Broadcom offer a range of four-side-scalable Sliicon Photomultiplier arrays featuring their NUV-MT SiPM technology.
NUV-MT SiPMs offer significant advantages in terms of Photon Detection Effficiency, Dark Count Rate and timing performance and are the recommended solution for all new designs and re-designs of existing systems.
These arrays are overmolded chip-on-board designs allowing for a tighter array pitch than is possible using discrete surface components.
The AFBR-S4N44P164M and AFBR-S4N44P044M are 4x4-pixel and 2x2-pixel arrays with a 4mm pitch based on the latest NUV-MT SiPM used in the AFBR-S4N44C014M SMT component. The 8.26 x 8.26mm² and 16 x 16mm² footprint arrays feature Broadcom's new over-molded PCB package with headline performance of 63% PDE at 420nm.
The AFBR-S4N66P024M is a 2x1 array based on the 6.14 x 6.14mm² active area SiPM used in the AFBR-S4N66C014M. The array footprint is 13.54 x 6.54mm² and is suitable for 4-side-tiling with an array pitch of <7mm. This array also features Broadcom's new over-molded PCB package design with excellent 63% PDE at 420nm.
The rear of the PCBs are populated with LGA contacts giving access to each SiPM. Users can therefore read out the SiPMs individually, in groups or sum the entire array - making them suitable for use with large scintillators or segmented scintillator arrays.
User Manuals & Guides | |
Product Brief, NUV-MT SiPM range | |
Brief Introduction to SiPM Technology | |
Evaluation board for single Broadcom SiPMs |
For more information on SiPMs and the performance characteristics of Broadcom NUV-MT products please visit our "What is an SiPM" article and SiPM Support pages accessed by the menu on the right of this page or