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SensL have produced technical notes with recommendations for handling and soldering of their SiPMs.

 

The technical notes cover TO-style and ceramic through-hole parts; Micro Leadframe Package (MLP) SMT packages and Through Silicon Via (TSV) SMT packages.

 

PDF icon Handling & soldering guidelines for TO- & Ceramic packages
PDF icon Handling & soldering SMT Micro Leadframe Package SiPMs
PDF icon Handling & soldering SMT Through Silicon Via packages

Quick Links: SiPMs


Quick Links: DAQs

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