SensL have produced technical notes with recommendations for handling and soldering of their SiPMs.
The technical notes cover TO-style and ceramic through-hole parts; Micro Leadframe Package (MLP) SMT packages and Through Silicon Via (TSV) SMT packages.
|Handling & soldering guidelines for TO- & Ceramic packages|
|Handling & soldering SMT Micro Leadframe Package SiPMs|
|Handling & soldering SMT Through Silicon Via packages|