SensL produce a variety of standard SiPM arrays but recognise that many users will prefer to develop their own bespoke array.
To support this process SensL have produced a detailed Technical Note "SMT 2D Array Reference Design" which describes the design and test of a 12x12 (144) pixel SiPM array using MicroFx-300XX-SMT devices in the Micro Leadframe Package (MLP).
Primarily, the design was carried out to investigate the achievable inter-pixel pitch and planarity when producing arrays using these devices and the document provides the results achieved by SensL.
To evaluate the functionality of the array, it was decided to design the board to have the same crosswire electrical output arrangement as SensL’s Matrix9 detector head. This enabled the array to be tested using the Matrix9 readout electronics and software but is not necessarily the optimum solution for customer's own arrays.
The document covers a number of key aspects which are applicable for any SiPM array design based on SensL’s MLP & TSV package SiPMs:-
- Handling of moisture sensitive SMT devices
- Array build considerations
- Electronics design
- Array testing
We recommend that any SiPM user developing their own arrays also review SensL’s technical notes covering handling & soldering guidelines for MLP-SMT and TSV-SMT devices.
SensL have produced a number of technical notes discussing readout methods for SiPM arrays.
|SMT 2D array reference design|
|Readout methods for SiPM arrays|
|Signal driven multiplexing array readout methods|
|Handling & Soldering Guidelines, C-Series MLP-SMT SiPMs|
|Handling & Soldering Guidelines, J-Series TSV-SMT SiPMs|