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TSVGroup6mm 300x300Released in October 2015 SensL's J-series SiPMs have been optimised for high-performance timing applications such as ToF-PET whilst the Through Silicon via (TSV) package is fully MRI compatible making them the ideal choice for combined MR-PET systems.

 

J-Series sensors achieve dramatically reduced standard-mode rise times of sub-300ps whilst recovery times are now <50ns (RC time constant). They also feature SensL’s patented fast-mode output which is improved over the C-Series equivalent with world-leading Coincidence Resolved Time performance of sub-160ps.

 

SensL's ultra-low Dark Count Rate is maintained at 35kHz/mm² (2.5V overbias) along with low Crosstalk/After-Pulsing and exceptional breakdown voltage uniformity of ±250mV.

 

Due to increased microcell density, peak PDE of >50% at 420nm is achieved whilst the glass TSV package enables significantly increased sensitivity far into the UV with cut-off at <250nm.

 

J-Series SiPMs are available in 3.08mm and 6.07mm active area sizes packaged in a TSV chip scale package that is compatible with industry standard, lead-free, reflow soldering processes. Package footprints of just 3.16mm and 6.13mm mean that J-Series SiPMs can be tiled in 2D arrays with extremely high geometric fill-factors - approaching 95% for the larger device.

 

J-Series SiPMs are high performance devices and so are only expected to be used in applications demanding their superior specification - if you are unsure as to whether J-Series is the best solution line for your application we recommend you review SensL's  product selection guide and White Paper "How to evaluate and compare SiPMs".

 

 

SiPM product selection guide
J-Series data sheet
J-Series user manual
Handling & Soldering Guidelines for TSV
Handling TSV arrays with scintillators
SMA and SMTPA board reference designs for TSV
SMT (MLP & TSV) array reference design
Readout methods for SiPM arrays
Signal driven multiplexing array readout

Quick Links: SiPMs


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