KETEK's NEW WL-Series SiPMs bring improvements to all key performance areas whilst retaining the leading-edge MSL1 rated surface mount packaging of the established WB-Series.
Key improvements offered by WL-Series SiPMs include:-
- High PDE; 51% (47µm microcell, 6.5V overbias)
- High Gain; 9.1M (47µm microcell, 6.5V overbias)
- Fast Recovery Time (Tau); (7ns, 15µm microcell)
- Industry-leading Saturation/Dynamic Range; 15µm
- Low DCR; 25kHz/mm² (15µm microcell, 2.5V overbias)
- Low Crosstalk; 4% (35µm microcell, 2.5V overbias)
- Low Afterpulsing; 1% at 2.5Vob
- Low Dark Current (max) ≡ DCR 45kHz/mm² (15µm microcell, 2.5V overbias)
- Low & Uniform Breakdown Voltage; 29.5±0.75V (±125mV per reel)
WL-Series SiPMs are offered as 3x3mm² active area devices using the same industry-leading package technology established with the WB-Series - BGA SMD featuring a glass window and "wrap-around" electrical contact design. This packaging technology significantly enhances the mechanical robustness of Ketek SiPMs compared to other surface mount SiPM designs and achieves an MSL1 rating.
As with the WB-Series KETEK offer the SMD component pre-mounted on a 2.54mm pitch 3-pin mini-PCB "Pin Adapter Board" for convenient testing using KETEK's SiPM evaluation kit or with customer's own circuitry.
For more information on KETEK SiPMs please refer to the Quick Links to the right of this page.